NETZSCH at the interpack 2011
interpack 2011 the worldwide leading exhibition for the packaging industry and the related process industry took place in Düsseldorf from May 12 to 18, 2011 with more than 2700 exhibitors from 60 countries and 166,000 trade visitors.
The NETZSCH-Group was represented with a booth of the business unit Grinding & Dispersing. During the exhibition trade visitors had the opportunity to inform themselves about NETZSCH solutions in making chocolate on plants of the type ChocoEasy®® or in grinding sugar on our newly developed CONDUX® 150 COMPACT EDITION.
A hesitant start on the first day of the exhibition was followed by an extremely positive interest of our visitors during the next days and resulted in high-quality contacts and many precise projects.
NETZSCH-Feinmahltechnik GmbH, since the beginning of the year a member of the Zentralfachschule der Deutschen Süßwarenwirtschaft e.V. (ZDS), used the occasion of the interpack to present ZDS officially with the sugar mill CONDUX® 150 COMPACT EDITION. The mill will be used for sugar grinding in the ZDS laboratory in Solingen.